Exact Maintenance System BGA3600

1. BGA3600 integrated structure design,can repair different sizes of BGA, QFP, CSP etc
2. BGA3600 mainly include accurate Optical Position and Pick & place System, Dark IR Reflow Soldering System, Software Control System, Visional Inspection System.

Precision Counter Soldering System BGA3200

BGA3200 rework table include BGA mounter system, transmission system and weld system. It used to rework and weld BGA and CSP chips. Achieve surface mounter pin and PCB surface board imaging synchronously and contraposition exactly. Accomplish BGA chips unsoldering and rewelding. It is the same with high precision component, such as QFP and PLCC.

Precision Counter Soldering System BGA3100

BGA3100 rework table include BGA mounter system, transmission system and weld system. It used to rework and weld BGA and CSP chips. Achieve surface mounter pin and PCB surface board imaging synchronously and contraposition exactly. Accomplish BGA chips unsoldering and rewelding. It is the same with high precision component, such as QFP and PLCC.

Desoldering Worktable BGA900-IR

The Desoldering Worktable BGA900-IR is manufactured by our company which is heating by infrared ray in double-sided, can heat from the top and preheat at the bottom. Suit to welding, removal or repair BGA, PBGA, CSP and variety of packages, can meet the multi-layer PCB substrate and unleaded welding requirements. Configuration can be completed on the planting table BGA to plant the ball. The device repair welding's mainly target is motherboards and graphics chip BGA of PC, desktops, switches, XBOX(including graphics chip, vedio card etc).