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Congratulations to TORCH for winning the 2021 China  International Automotive Regulatory Power Device Packaging Service Annual High Quality Supplier Award

Date: 2021-11-5

At the 2021 China International vehicle specification level power semiconductor annual conference held from November 4 to 5, 2021, TORCH won the 2021 China International vehicle specification level power device packaging service annual quality supplier award. 



The 2021 China International Automotive Power Semiconductor annual conference co sponsored by Wangcai new media and China International Automotive Power Semiconductor organizing committee was held in Sheraton Hotel, Jiading, Shanghai from November 4 to 5. The meeting will be held in closed doors and can only be attended by invitation. The conference is dedicated to providing professional services to Chinese vehicle specification power semiconductor R&D and packaging service enterprises, and is committed to providing a platform for vehicle specification power semiconductor enterprises to improve their voice and voice opportunities.
In the current environment of serious shortage of vehicle specification level chips in both international and domestic markets, the international vehicle specification level power semiconductor annual conference was held in a very timely manner, and almost all excellent design enterprises, wafer factories and packaging enterprises in the industry were gathered. We will discuss the latest technology and packaging process together, and entrepreneurs and industry technical experts will discuss how to deal with the current situation of general lack of core in the industry. At this meeting, TORCH won the 2021 Jinling award and the annual high-quality supplier award of China International vehicle specification power device packaging service. The following is the scene of the meeting and award presentation.

Wen Aixin, vice president of sales of TORCH, came to the stage to receive the award.

At this year's China International Automotive Power Semiconductor annual conference, experts from the semiconductor industry were invited to discuss / share the development trend, resource sharing and win-win cooperation of the future automotive power semiconductor industry.

TORCH thanks all customers and friends for their attention and support. TORCH are committed to solving the situation that the packaging equipment in the power semiconductor industry is monopolized by imported equipment, launching a fully automatic IGBT packaging production line, and helping China's power semiconductor industry to achieve autonomy and control in the equipment field. TORCH will provide overall solutions for the majority of customers in the power semiconductor industry with vacuum packaging equipment, nano silver sintering equipment and wafer patch equipment, so that customers can realize the independent control of core equipment and process, make the rapid development of China's power "core", solve the problem of shortage at present, and achieve a healthy development situation in the future!