Date: 2019-12-16
T1 is a multi-function placement machine, also a submicron flip eutectic placement machine, providing placement accuracy up to 5 microns, suitable for all kinds of flip chip, common chip mounting, can handle the minimum chip spacing as low as 50 microns.
This universal SMD platform is suitable for a wide range of microassembly applications, covering almost all microassembly SMD processes, and can even be configured as cutting-edge FC/SMD repair systems.
Mainly for small and medium volume production, and to meet the needs of prototype manufacturing, research and development and university teaching and research.
Submicron flip eutectic mounter
Application:
Flip chip bonding (face down)
High precision chip bonding (face up)
Laser diode, laser bar welding
VCSEL, PD, lens assembly package
High-end LED packaging
Micro-optics device packaging
MEMS encapsulation
Sensor package
3 d packaging
Wafer level packaging (W2W, C2W)
Chip to glass substrate, chip to flexible substrate mount
Process:
Hot pressing
Hot - ultrasound
ultrasonic
Reflux, sintering (tin, C4, indium, eutectic)
Adhesive technology
Curing (uv, temperature)
Mechanical assembly
Highlights:
Mounting accuracy: better than 5 inch m
Component dimensions: 0.125 mm x 0.125 mm - 100 mm x 100 mm*
Maximum working area: 450 mm x 122 mm*
Supported maximum wafer size: 8"
Maximum patch pressure supported: 700 N*
Can be configured as a cutting-edge hot air repair system
Manual, semi-automatic matching
Features:
Automatic process and data processing
Spectroscopic image alignment system
Process integration process management
Real-time process observation camera
Intelligent system software and adaptive library
Process transfer between different systems, covering almost all high - end interconnection process
Modular design, strong process flexibility
Advantages of submicron flip eutectic mounter:
No - hand chip mount, eliminate the influence of personnel factors
Excellent mounting accuracy, out of the box, no need to adjust
Achieve synchronous control of all process parameters: pressure, temperature, time, power, process environment, and lighting and video
Real-time observation and feedback greatly reduce process development time
Process development is simple and convenient, supporting automatic process recording
Rapid realization of the research and development process into production process
High return on investment, one platform for all process applications
Technical parameters of submicron flip eutectic mounter:
Field of view (minimum): 1.6mm*1.2mm
Field of view (maximum): 20mm*15mm
Component size (minimum) :0.125mm*.125mm
Element size (minimum) :40mm*40mm
Φ shaft fine-tuning: plus or minus 6°
Z-axis travel of the workbench: 10mm
Working area: 280mm*117mm
Heating temperature (Max.) 400
Patch pressure (Max) 700N
Modules and options:
ACF module
Module balls
Patch force control module (automatic)
Chip heating module
Blue film chip module
Camera moving module
Inert gas protection module
Process video observation module
Friction module
Substrate heating module
If you are interested in our products, please visit our website (www.torch.cc) or search Eutectic mounter on baidu to learn about our products.